Zhongshan Kasatani Co., Ltd.TOP_图片
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Business Introduction
Realize the precision stamping processing cultivated by automotive DENSO parts and mobile phone parts
With the increase of new energy vehicles, the market for high-voltage conductive plates and press-formed parts will increase further.
The company will meet customer demand by utilizing past experience and actual results consistently.
Business Introduction
Business Introduction
Material Various copper materials:C19720、C1100、C5210、C5191 etc.
Various aluminum materials:A5052、A1050 etc.
Various stainless steel:SUS304、301、430、631
Size Board Thickness 0.1mm to 3.0mm, board width max 300mm
Processing Item Precision stamping, assembly, riveting, automatic tapping, insert molding
Component cleaning Hydrocarbon (JX/NX Cleaning)
Main Purpose Automotive-related, OA-related, mobile-related, connector-related
Major Customers (Slightly omitted, ranked in no particular order) Sumitomo Denso, Yazaki , Fujikura, Asmo, Ricoh, Kyocera, Konica Minolta, Fuji Xerox, Citizen, Sharp, Panasonic, Ushio,Nittan, etc.

Achieving precise processing by relying on Japan's advanced technology

Based on "creating new technologies with ingenuity", we can meet customers' high quality requirements through mold design.

Reassuring tracking and quality management

Through purchasing materials from the outstanding manufacturers, by resorting to Japanese companies' unique quality management, we bring customers peace of mind.

Extensive material purchase and sales system

■Our company is located in the factory area of Zhongshan Iwatani Co., Ltd., which is the premier stainless steel and non-ferrous rolling material center in the industry. We are able to consistently complete the entire process from material purchase, notch processing to stamping processing. We enjoy advantages in cost competitiveness and wide choices of materials.

■It can realize bonded transfer and RMB general trade. Payment can be made in any currency such as U.S. dollars, Hong Kong dollars, renminbi, yen, etc.

Automatic Vehicle Product Use Examples
Automatic Vehicle Product Use Examples
Composite Product  Insert Molding

Power semiconductor devices

For power semiconductor modules, from the design of terminal stamping dies and molding dies, to terminal stamping and resin insert molding, one correspondence is possible.
Power semiconductor devices

Processing Examples

Power semiconductor devices Examples
Power semiconductor devices Examples
Power semiconductor devices Examples
Material:
Copper and Copper Alloy

Smartphone backplane

It is capable of metal plate stamping and resin molding in one-stop production. It comprehensively studies the integration of sheet metal stamping parts and press-into-molded parts and formulates the best shape solution. In punching and insert molding, the combination with superhard aluminum is actively promoted. In addition, according to the requirement of being ultra-thin and lightweight on the market, we are also studying the punching of thin materials and magnesium materials, and carry out batch insert molding.
Smartphone backplane

Processing Examples

Smartphone backplane Processing
Material:
GM55 (high-intensity aluminum) or US (spring)

Charging terminal

It can fully study the metal stamping parts and resin molding parts, formulate the best shape solution of waterproof charging terminal.
In order to reduce costs, a gold-plated bar-shaped material is used. In the resin molding processng, the insert molding is performed in a FOUP shape in order to improve the efficiency.
Charging terminal

Processing Examples

Charging terminal processing  Examples image
Material:
SUS (spring) gold plated material
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